APA (7th ed.) Citation

Chen, A., & Lo, R. H. (2012). Semiconductor Packaging: Materials Interaction and Reliability (1.). CRC Press. https://doi.org/10.1201/b11260

Chicago Style (17th ed.) Citation

Chen, Andrea, and Randy Hsiao-Yu Lo. Semiconductor Packaging: Materials Interaction and Reliability. 1. United States: CRC Press, 2012. https://doi.org/10.1201/b11260.

MLA (9th ed.) Citation

Chen, Andrea, and Randy Hsiao-Yu Lo. Semiconductor Packaging: Materials Interaction and Reliability. 1. CRC Press, 2012. https://doi.org/10.1201/b11260.