Semiconductor Packaging Materials Interaction and Reliability

• Main Authors: Chen, Andrea, Lo, Randy Hsiao-Yu
• Format: eBook Book
• Language: English
• Published: United States CRC Press 2012; Taylor & Francis; Taylor & Francis Group
• Edition: 1
• Subjects: array; ball; Circuits and Devices; compound; Electrical engineering; ElectricalEngineering; Electromagnetics and Microwaves; Electronic Packaging; Electronics; Electronics and communications engineering; Electronics engineering; Electronics: circuits and components; ENG; frame; grid; Integrated circuits; Interconnects (Integrated circuit technology); lead; level; MATERIALS; Materials science; Mechanical engineering and materials; Microelectronic packaging; Military & nautical engineering; molding; package; SCI-TECH; Semiconductors; STM; Technology & Engineering; TECHNOLOGY & ENGINEERING / Electronics / Circuits / General. bisacsh; TECHNOLOGY & ENGINEERING / Electronics / General. bisacsh; TECHNOLOGY & ENGINEERING / Material Science. bisacsh; Technology, Engineering, Agriculture, Industrial processes; wafer; Surface Mount Technology; materials interaction; reliability testing; Lead Free Solder; Underfill Materials; Solder Reflow; Tin Whiskers; Quad Flat Pack; metals; hermetic packaging; LEDs; Eutectic Tin Lead Solder; Mem Device; Die Attach; Ball Grid Array; nondestructive analysis; Solder Joint; Semiconductor Packaging; Aluminum Nitride; package families; BGA Package; Plastic Leaded Chip Carriers; package reliability; Molding Compound; plastic packaging; Small Outline Packages; PBGA; Flip Chip Interconnects; semiconductor packages; Plastic Dual In-line Package; surface-mount technology; Aluminum Bond Pads; destructive testing; package form factor; polymer adhesives; Flip Chip; ceramics and glasses; Heat Spreader; Chip Scale Packages
• ISBN: 9781439862070; 1439862079; 9781439862056; 113807540X; 9781138075405; 1439862052
• DOI: 10.1201/b11260

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.