Asymmetric Heat Transfer with Linear Conductive Metamaterials

Asymmetric heat transfer systems, often referred to as thermal diodes or thermal rectifiers, have garnered increasing interest due to their wide range of application possibilities. Most of those previous macroscopic thermal diodes either resort to nonlinear thermal conductivities with strong tempera...

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Bibliographic Details
Published inarXiv.org
Main Authors Su, Yishu, Li, Ying, Qi, Minghong, Guenneau, Sebastien, Li, Huagen, Xiong, Jian
Format Paper Journal Article
LanguageEnglish
Published Ithaca Cornell University Library, arXiv.org 08.09.2022
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Summary:Asymmetric heat transfer systems, often referred to as thermal diodes or thermal rectifiers, have garnered increasing interest due to their wide range of application possibilities. Most of those previous macroscopic thermal diodes either resort to nonlinear thermal conductivities with strong temperature dependence that may be quite limited by or fixed in natural materials or rely on active modulation that necessitated auxiliary energy payloads. Here, we establish a straightforward strategy of passively realizing asymmetric heat transfer with linear conductive materials. The strategy also introduces a new interrogative perspective on the design of asymmetric heat transfer utilizing nonlinear thermal conductivity, correcting the misconception that thermal rectification is impossible with separable nonlinear thermal conductivity. The nonlinear perturbation mode can be versatilely engineered to produce an effective and wide-ranging perturbation in the heat conduction, which imitates and bypasses intrinsic thermal nonlinearity constraints set by naturally occurring counterparts. Independent experimental characterizations of surface thermal radiation and thermal convection verified that the heat exchange between a graded linear thermal metamaterial and the ambient can be tailored to achieve macroscopic asymmetric heat transfer. Our work is envisaged to inspire conceptual models for heat transfer control, serving as a robust and convenient platform for advanced thermal management, thermal computation, and heat transport.
ISSN:2331-8422
DOI:10.48550/arxiv.2209.03583