Copper Large-scale Grain Growth by UV Nanosecond Pulsed Laser Annealing

UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surr...

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Bibliographic Details
Published inarXiv.org
Main Authors Tabata, Toshiyuki, Pierre-Edouard Raynal, Rozé, Fabien, Halty, Sébastien, Thuries, Louis, Fuccio Cristiano, Scheid, Emmanuel, Mazzamuto, Fulvio
Format Paper Journal Article
LanguageEnglish
Published Ithaca Cornell University Library, arXiv.org 15.11.2021
Subjects
Copper
Enlargement
Grain growth
Grain size
High temperature
Laser beam annealing
Laser beam heating
Nanosecond pulses
Physics - Applied Physics
Pulsed lasers
Thin films
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Summary:UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surrounding structures. In this work UV NLA is applied on a typical Cu thin film, demonstrating a mean grain size of over 1 {\mu}m and 400 nm in a melt and sub-melt regime, respectively. Along with such grain enlargement, film resistivity is also reduced.
ISSN:2331-8422
DOI:10.48550/arxiv.2111.07580