Colloidal Drop Deposition on Porous Substrates: Competition among Particle Motion, Evaporation, and Infiltration

• Published in: Langmuir Vol. 31; no. 29; pp. 7953 - 7961
• Main Authors: Pack, Min, Hu, Han, Kim, Dong-Ook, Yang, Xin, Sun, Ying
• Format: Journal Article
• Language: English
• Published: United States American Chemical Society 28.07.2015
• ISSN: 0743-7463; 1520-5827
• DOI: 10.1021/acs.langmuir.5b01846

Recent interest in printable electronics and in particular paper- and textile-based electronics has fueled research in inkjet printing of colloidal drops on porous substrates. On nonporous substrates, the interplay of particle motion and solvent evaporation determines the final deposition morphology of the evaporating colloidal drop. For porous substrates, solvent infiltration into the pores adds a layer of complexity to the deposition patterns that have not been fully elucidated in the literature. In this study, the deposition of picoliter-sized aqueous colloidal droplets containing nanometer- and micrometer-sized particles onto nanoporous anodic aluminum oxide substrates is examined for different drop and particle sizes and relative humidities as well as pore diameters, porosities, and wettabilities of the porous substrates. For the cases considered, solvent infiltration is found to be much faster than both evaporation and particle motion near the contact line, and thus when the substrate fully imbibes the solvent, the well-known “coffee-ring” deposition is suppressed. However, when the solvent is only partially imbibed, a residual droplet volume exists upon completion of the infiltration. For such cases, two time scales are of importance: the time for particle motion to the contact line as a result of both diffusion and advection, t P, and the evaporation time of the residual drop volume, t EI. Their ratio, t P/t EI, determines whether the coffee-ring deposition will be formed (t P/t EI < 1) or suppressed (t P/t EI > 1).