Atomic Beam-Induced Fluorination of Polyimide and Its Application to Site-Selective Cu Metallization

• Published in: Langmuir Vol. 23; no. 23; pp. 11351 - 11354
• Main Authors: Tagawa, Masahito, Maeda, Ken-ichi, Kajita, Tadashi, Yokota, Kumiko, Akamatsu, Kensuke, Nawafune, Hidemi
• Format: Journal Article
• Language: English
• Published: Washington, DC American Chemical Society 06.11.2007
• Subjects: Chemistry; Colloidal state and disperse state; Exact sciences and technology; General and physical chemistry; Surface physical chemistry; Water; Polyimide; Translational energy; Wettability; Oxygen; Storage; Fluorine; Air; Contact angle; Hydrophobicity; Fluorination; Electroless plating
• ISSN: 0743-7463; 1520-5827
• DOI: 10.1021/la701339p

Metallization methods of polyimide by hyperthermal atomic oxygen and atomic fluorine beams were developed. An atomic fluorine beam with a translational energy of 6.2 eV modified the wettability of polyimide surfaces to provide an advancing water contact angle of 132°. It was confirmed that in-air storage for 2 months did not alter the hydrophobic property created by the atomic fluorine beam. This stable beam-induced surface fluorination technique was then applied to site-selective electroless Cu plating on polyimide. It was demonstrated that changing the exposure sequence could create both positive- and negative-type plating processes.