Solid-State Bonding Technique for Template-Stripped Ultraflat Gold Substrates

• Published in: Langmuir Vol. 22; no. 6; pp. 2437 - 2440
• Main Authors: Mosley, David W, Chow, Brian Y, Jacobson, Joseph M
• Format: Journal Article
• Language: English
• Published: Washington, DC American Chemical Society 14.03.2006
• Subjects: Chemistry; Exact sciences and technology; General and physical chemistry; Substrate; Solid state; Gold; Stability; Impurity; Surface defect; Preparation; Transition metal; Aluminium; Diffusion; Foil; Template

A simple procedure using gold diffusion bonding for the preparation of template-stripped gold (TSG) surfaces is described. TSG surfaces are useful for surface studies because a very consistent flat gold surface with few defects can be easily prepared. We have developed a method of producing TSG surf...