Solid-State Bonding Technique for Template-Stripped Ultraflat Gold Substrates
A simple procedure using gold diffusion bonding for the preparation of template-stripped gold (TSG) surfaces is described. TSG surfaces are useful for surface studies because a very consistent flat gold surface with few defects can be easily prepared. We have developed a method of producing TSG surf...
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Published in | Langmuir Vol. 22; no. 6; pp. 2437 - 2440 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Washington, DC
American Chemical Society
14.03.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A simple procedure using gold diffusion bonding for the preparation of template-stripped gold (TSG) surfaces is described. TSG surfaces are useful for surface studies because a very consistent flat gold surface with few defects can be easily prepared. We have developed a method of producing TSG surfaces that relies only on gold diffusion bonding rather than epoxies. The resulting substrates are free from concerns of solvent compatibility, heat stability, and impurities. Bonding of centimeter-sized substrates is performed at 300 °C for 2 h using a vise and aluminum foil. |
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Bibliography: | ark:/67375/TPS-LMK5HVWN-S istex:07F127AEC26A8BE1D663CAFD0BACE0463948A566 ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0743-7463 1520-5827 |
DOI: | 10.1021/la052650s |