Solid-State Bonding Technique for Template-Stripped Ultraflat Gold Substrates

A simple procedure using gold diffusion bonding for the preparation of template-stripped gold (TSG) surfaces is described. TSG surfaces are useful for surface studies because a very consistent flat gold surface with few defects can be easily prepared. We have developed a method of producing TSG surf...

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Bibliographic Details
Published inLangmuir Vol. 22; no. 6; pp. 2437 - 2440
Main Authors Mosley, David W, Chow, Brian Y, Jacobson, Joseph M
Format Journal Article
LanguageEnglish
Published Washington, DC American Chemical Society 14.03.2006
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Summary:A simple procedure using gold diffusion bonding for the preparation of template-stripped gold (TSG) surfaces is described. TSG surfaces are useful for surface studies because a very consistent flat gold surface with few defects can be easily prepared. We have developed a method of producing TSG surfaces that relies only on gold diffusion bonding rather than epoxies. The resulting substrates are free from concerns of solvent compatibility, heat stability, and impurities. Bonding of centimeter-sized substrates is performed at 300 °C for 2 h using a vise and aluminum foil.
Bibliography:ark:/67375/TPS-LMK5HVWN-S
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ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0743-7463
1520-5827
DOI:10.1021/la052650s