Coupled Heat-Deformation-Flow Analysis for Clayey Soil

Thermal stress imposed on soil is coupled with the expulsion of pore fluid resulting in thermomechanical fluid flow. This paper describes a coupled flow-deformation model subjected to a constant temperature. Two-dimensional numerical modeling was performed based on the finite element method applied...

Full description

Saved in:
Bibliographic Details
Published inJournal of geotechnical and geoenvironmental engineering Vol. 132; no. 4; pp. 521 - 525
Main Authors Neaupane, Krishna Murari, Nanakorn, Pruettha
Format Journal Article
LanguageEnglish
Published New York, NY American Society of Civil Engineers 01.04.2006
Subjects
Applied sciences
Buildings. Public works
Exact sciences and technology
Geotechnics
Soil investigations. Testing
TECHNICAL NOTES
Thermal stress
Sensitivity analysis
Deformation
Fluid flow
Theoretical study
Heat flow
Clay soil
Clays
Thermodynamics
Experimental result
Energy conservation
Soil test
Numerical simulation
Coupling
Comparative study
Thermal stresses
Online AccessGet full text

Cover

More Information
Summary:Thermal stress imposed on soil is coupled with the expulsion of pore fluid resulting in thermomechanical fluid flow. This paper describes a coupled flow-deformation model subjected to a constant temperature. Two-dimensional numerical modeling was performed based on the finite element method applied to thermoporoelasticity. The model evolves from application of the principles of irreversible thermodynamics. A heating experiment was designed to measure temperature and thermal deformation at predefined locations in a cylindrical clay disk. Results from the experiment are compared with the simulated results to validate the numerical scheme. Sensitivity analysis of the developed code reaffirmed that the coupling effects are most pronounced for high porosity and low permeability medium.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1090-0241
1943-5606
DOI:10.1061/(ASCE)1090-0241(2006)132:4(521)