Spontaneous Reduction of Copper(II) to Copper(I) at Solid–Liquid Interface

• Published in: The journal of physical chemistry letters Vol. 9; no. 21; pp. 6364 - 6371
• Main Authors: Rana, Shammi, Prasoon, Anupam, Sadhukhan, Pampa, Jha, Plawan Kumar, Sathe, Vasant, Barman, Sudipta Roy, Ballav, Nirmalya
• Format: Journal Article
• Language: English
• Published: United States American Chemical Society 01.11.2018
• ISSN: 1948-7185; 1948-7185
• DOI: 10.1021/acs.jpclett.8b02844

Oxidation and reduction reactions are of central importance in chemistry as well as vital to the basic functions of life and such chemical processes are generally brought about by oxidizing and reducing agents, respectively. Herein, we report the discovery of an interfacial reduction reaction (IRR) – without the use of any external reducing agent. In course of metal–ligand coordination, spontaneous reduction of Cu­(II) to Cu­(I) at a solid–liquid interface was observed–unlike in a liquid-phase reaction where no reduction of Cu­(II) to Cu­(I) was occurred. High-quality thin films of a new coordination network compound bearing a Fe­(II)–CN–Cu­(I) link were fabricated by IRR and employed for efficient electro-catalysis in the form of oxygen reduction reaction. Also, thermally activated reversible structural phase transition modulated the electron transport property in thin film. This work unveils the importance of chemical reactions at solid–liquid interfaces that can lead to the development of new functional thin film materials.