Stamp Collapse in Soft Lithography
We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the...
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| Published in | Langmuir Vol. 21; no. 17; pp. 8058 - 8068 |
|---|---|
| Main Authors | , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Washington, DC
American Chemical Society
16.08.2005
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| Subjects | |
| Online Access | Get full text |
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| Abstract | We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data. |
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| AbstractList | We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data. |
| Author | Huang, Yonggang Y Park, Jang-Ung Rogers, John A Zhou, Weixing Menard, Etienne Hsia, K. J Alleyne, Andrew G |
| Author_xml | – sequence: 1 givenname: Yonggang Y surname: Huang fullname: Huang, Yonggang Y – sequence: 2 givenname: Weixing surname: Zhou fullname: Zhou, Weixing – sequence: 3 givenname: K. J surname: Hsia fullname: Hsia, K. J – sequence: 4 givenname: Etienne surname: Menard fullname: Menard, Etienne – sequence: 5 givenname: Jang-Ung surname: Park fullname: Park, Jang-Ung – sequence: 6 givenname: John A surname: Rogers fullname: Rogers, John A – sequence: 7 givenname: Andrew G surname: Alleyne fullname: Alleyne, Andrew G |
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| Cites_doi | 10.1021/la00053a033 10.1021/la036332+ 10.1126/science.1094196 10.1021/nl0344007 10.1557/mrs2001.121 10.1115/1.801535 10.1063/1.1900303 |
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| Title | Stamp Collapse in Soft Lithography |
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