Stamp Collapse in Soft Lithography

We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the...

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Bibliographic Details
Published inLangmuir Vol. 21; no. 17; pp. 8058 - 8068
Main Authors Huang, Yonggang Y, Zhou, Weixing, Hsia, K. J, Menard, Etienne, Park, Jang-Ung, Rogers, John A, Alleyne, Andrew G
Format Journal Article
LanguageEnglish
Published Washington, DC American Chemical Society 16.08.2005
Subjects
Chemistry
Exact sciences and technology
General and physical chemistry
Substrate
Scaling law
Experimental data
Lithography
Adhesion
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Summary:We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.
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ISSN:0743-7463
1520-5827
DOI:10.1021/la0502185