Recent developments in high integration multi-standard CMOS transceivers for personal communication systems

• Published in: International Symposium on Low Power Electronics and Design: Proceedings of the 1998 international symposium on Low power electronics and design; 10-12 Aug. 1998 pp. 149 - 154
• Main Authors: Rudell, Jacques C., Ou, Jia-Jiunn, Narayanaswami, R. Sekhar, Chien, George, Weldon, Jeffrey A., Lin, Li, Tsai, King-Chun, Tee, Luns, Khoo, Kelvin, Au, Danelle, Robinson, Troy, Gerna, Danilo, Otsuka, Masanori, Gray, Paul R.
• Format: Conference Proceeding
• Language: English
• Published: New York, NY, USA ACM 10.08.1998; IEEE
• Series: ACM Conferences
• Subjects: Applied computing > Computers in other domains > Personal computers and PC applications; Applied computing > Physical sciences and engineering > Electronics; Applied computing > Physical sciences and engineering > Engineering; CMOS technology; Computer systems organization > Dependable and fault-tolerant systems and networks; Dynamic range; General and reference > Cross-computing tools and techniques > Performance; Hardware > Integrated circuits > Semiconductor memory; Hardware > Robustness; Networks > Network performance evaluation; Networks > Network protocols; Permission; Radio frequency; Radio transmitters; Receivers; RF signals; Silicon; Standards development; Transceivers
• ISBN: 1581130597; 9781581130591
• DOI: 10.1145/280756.280868

Issues associated with the integration of transceiver components on to a single silicon substrate are discussed. In particular, recently proposed receiver and transmitter architectures for high integration are examined on the promise of providing multistandard capability. In addition, existing barriers to lower power transceiver operation are examined as well as some proposed directions for future integrated transceiver research and development.