Photopatternable Silicon Elastomers with Enhanced Mechanical Properties for High-Fidelity Nanoresolution Soft Lithography
Soft lithography has been widely used in stamping and printing processes for microfabrication as a low cost alternative to photolithography. However, conventional poly(dimethyl)siloxane (PDMS) stamp materials have limitations, especially in the submicrometer range, due to their low physical toughnes...
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Published in | The journal of physical chemistry. B Vol. 109; no. 46; pp. 21525 - 21531 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
United States
American Chemical Society
24.11.2005
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Online Access | Get full text |
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Summary: | Soft lithography has been widely used in stamping and printing processes for microfabrication as a low cost alternative to photolithography. However, conventional poly(dimethyl)siloxane (PDMS) stamp materials have limitations, especially in the submicrometer range, due to their low physical toughness and requirements for thermocuring. A new version of functional stamp materials with adjustable physical toughness has been developed for advanced soft lithography. We thus demonstrate here its photopatternability and nanoresolution soft lithography, which have proven to be difficult using commercial stamp materials. |
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Bibliography: | ark:/67375/TPS-3DJP74P4-Q istex:F4748ECF7824E6813A8E143BFCFF35C155B0F726 ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 1520-6106 1520-5207 |
DOI: | 10.1021/jp050302t |