Structural and Optical Properties of Textured Silicon Substrates by Three-Step Chemical Etching

We implemented the fabrication of hybrid structures, including pyramids, etching holes, and inverted pyramidal cavities on silicon substrates, by three-step chemical etching. To achieve this, we utilized anisotropic wet etching as the first-step etching to form pyramids of various sizes. Subsequentl...

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Published inLangmuir Vol. 37; no. 31; pp. 9622 - 9629
Main Authors Ou, Hui-Fang, Lin, Yu-Keng, Hsueh, Chun-Hway
Format Journal Article
LanguageEnglish
Published American Chemical Society 10.08.2021
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Summary:We implemented the fabrication of hybrid structures, including pyramids, etching holes, and inverted pyramidal cavities on silicon substrates, by three-step chemical etching. To achieve this, we utilized anisotropic wet etching as the first-step etching to form pyramids of various sizes. Subsequently, metal-assisted chemical etching was performed to develop aligned etching holes on the pyramidal structure. Ultimately, anisotropic wet etching was used again as the third-step etching for the etchant to penetrate holes to form inverted pyramidal cavities. Optimizing the three-step etching treatments, large-scale textured structures with low reflectance could be obtained, and they show potential for applications in sensors, solar cells, photovoltaics, and surface-enhanced Raman scattering (SERS). Examples of using the textured silicon substrates for SERS applications were given.
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ISSN:0743-7463
1520-5827
DOI:10.1021/acs.langmuir.1c01611