Polyimide-Side-Chain Tethered Polyhedral Oligomeric Silsesquioxane Nanocomposites for Low-Dielectric Film Applications

Low-dielectric-constant nanoporous films (dielectric constant, k = 2.4) with thermal integrity and controllable mechanical strength have been prepared by covalently tethering nanoporous polyhedral oligomeric silsesquioxane (POSS) molecules, 1-nm size, to the side chains of polyimide. The tethered PO...

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Bibliographic Details
Published inChemistry of materials Vol. 15; no. 19; pp. 3721 - 3727
Main Authors Leu, Chyi-Ming, Chang, Yao-Te, Wei, Kung-Hwa
Format Journal Article
LanguageEnglish
Published Washington, DC American Chemical Society 23.09.2003
Subjects
Applied sciences
Chemical modifications
Exact sciences and technology
Inorganic and organomineral polymers
Physicochemistry of polymers
Polyimide
Condensation reaction
Property composition relationship
Silsesquioxane polymer
Dielectric properties
Aromatic polymer
Mechanical properties
Experimental study
Porous material
Structure composition relationship
Cyclic polymer
Morphology
Preparation
Three dimensional polymer
Imide copolymer
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Summary:Low-dielectric-constant nanoporous films (dielectric constant, k = 2.4) with thermal integrity and controllable mechanical strength have been prepared by covalently tethering nanoporous polyhedral oligomeric silsesquioxane (POSS) molecules, 1-nm size, to the side chains of polyimide. The tethered POSS molecules in the amorphous polyimide retain a nanoporous crystal structure, but form an additional ordered architecture due to microphase separation. With this approach, the dielectric constant of the film can be tuned by the amount of POSS molecules introduced in the nanocomposite film; the polyimide molecules offer additional advantages of maintaining certain thermal and mechanical strengths.
Bibliography:istex:FB9F361F445F8A6D4972EA46ECB8675680F5DD62
ark:/67375/TPS-1PCFLJN8-3
ISSN:0897-4756
1520-5002
DOI:10.1021/cm030393b