Cure Kinetics and Properties of High Performance Cycloaliphatic Epoxy Resins Cured with Anhydride

• Published in: Industrial & engineering chemistry research Vol. 58; no. 16; pp. 6907 - 6918
• Main Authors: Lu, Maoping, Liu, Yingchun, Du, Xiangxiang, Zhang, Shiheng, Chen, Guokang, Zhang, Qian, Yao, Sa, Liang, Liyan, Lu, Mangeng
• Format: Journal Article
• Language: English
• Published: American Chemical Society 24.04.2019
• ISSN: 0888-5885; 1520-5045
• DOI: 10.1021/acs.iecr.8b06442

In this work, a cycloaliphatic epoxy resin hexahydrophthalic acid bis­(3,4-epoxycyclohexylmethyl) ester (BE) was prepared and cured with anhydride. The curing kinetics and properties of the cycloaliphatic epoxy resin were characterized and compared with (3′,4′-epoxycyclohexane) methyl-3,4-epoxycyclohexyl-carboxylate (CE) and bis­(3,4-epoxycyclohexylmethyl) adipate (BA). The result shows that BE/4-methyl hexahydrophthalic anhydride (MHHPA) exhibits a higher reaction activation energy and a slower curing rate than CE/MHHPA and BA/MHHPA. The loss modulus of BE/MHHPA increased 53 and 24% compared to CE/MHHPA and BA/MHHPA, respectively. The Young’s modulus and initial degradation temperature of BE/MHHPA improved 31 and 6.4% compared with those of BA/MHHPA. Furthermore, superior moisture resistance and dielectric properties are expressed for BE/MHHPA among these epoxy resins. Those results demonstrated the potential usefulness of BE/MHHPA in the electronic packaging materials field.