Water Repellent Periodic Mesoporous Organosilicas

This paper demonstrates for the first time thermally induced gradual hydrophobization, monitored quantitatively by ellipsometric porosimetry, of four prototypical periodic mesoporous organosilicas (PMOs) that are tailored through materials chemistry for use as low-dielectric-constant (low k) materia...

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Published inACS nano Vol. 5; no. 2; pp. 1267 - 1275
Main Authors Wang, Wendong, Grozea, Daniel, Kohli, Sandeep, Perovic, Douglas D, Ozin, Geoffrey A
Format Journal Article
LanguageEnglish
Published United States American Chemical Society 22.02.2011
Subjects
periodic mesoporous organosilica
hybrid materials
mesoporous materials
water repellency
ellipsometric porosimetry
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Summary:This paper demonstrates for the first time thermally induced gradual hydrophobization, monitored quantitatively by ellipsometric porosimetry, of four prototypical periodic mesoporous organosilicas (PMOs) that are tailored through materials chemistry for use as low-dielectric-constant (low k) materials in microprocessors. Theoretical aspects of this quantification are briefly discussed. A comparison of structural, mechanical, dielectric, and hydrophobic properties of ethane, methane, ethene, and 3-ring PMOs is made. Particularly, ethane, methane, and 3-ring PMOs show impressive water repellency at post-treatment temperatures as low as 350 °C, with corresponding Young’s modulus values greater than 10 GPa and k values smaller than 2, a figure of merit that satisfies the technological requirements of future generation microchips.
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ISSN:1936-0851
1936-086X
DOI:10.1021/nn102929t