Silylcarborane Acrylate Nanoimprint Lithography Resists

The synthesis of a novel silylcarborane acrylate monomer is reported as well as its application as an etch-resistant component for the formulation of imprint layers for UV nanoimprint lithography (NIL). By introduction of 10% by weight of the silylcarborane acrylate monomer into NIL resist formulati...

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Bibliographic Details
Published inACS applied materials & interfaces Vol. 1; no. 9; pp. 1887 - 1892
Main Authors Simon, Yoan C, Moran, Isaac W, Carter, Kenneth R, Coughlin, E. Bryan
Format Journal Article
LanguageEnglish
Published United States American Chemical Society 30.09.2009
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Summary:The synthesis of a novel silylcarborane acrylate monomer is reported as well as its application as an etch-resistant component for the formulation of imprint layers for UV nanoimprint lithography (NIL). By introduction of 10% by weight of the silylcarborane acrylate monomer into NIL resist formulations, the oxygen plasma etch rate of the resulting film was reduced by nearly a factor of 2. When used in NIL, the patterned resist layer had excellent oxygen plasma etch resistance, leading to effective image transfer to the underlying poly(hydroxyethyl methacrylate) lift-off layer. The latter allowed for the fabrication of metallic interdigitated electrode patterns via a NIL/lift-off process. This work demonstrates the robustness of silylcarborane-containing resists and paves the way for the investigation of new, high-resolution patterning methods.
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ISSN:1944-8244
1944-8252
DOI:10.1021/am9002292