Electroless Deposition of Cu on Glass and Patterning with Microcontact Printing
Electroless-depositing a metal from solution to a substrate and patterning it using microcontact printing is an alternative to the conventional patterning of vacuum-deposited metals using photolithography. Here, we pattern Cu onto 15 × 15 sq-inch glass substrates by (i) self-assembly of a thin layer...
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Published in | Langmuir Vol. 19; no. 17; pp. 6567 - 6569 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
American Chemical Society
19.08.2003
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Online Access | Get full text |
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Summary: | Electroless-depositing a metal from solution to a substrate and patterning it using microcontact printing is an alternative to the conventional patterning of vacuum-deposited metals using photolithography. Here, we pattern Cu onto 15 × 15 sq-inch glass substrates by (i) self-assembly of a thin layer of amino-derivatized silanes to the glass, (ii) binding Pd/Sn catalytic particles to the silanes, (iii) electroless deposition of ∼120 nm of Cu on the catalytic surface, (iv) microcontact printing hexadecanethiol on the Cu film using an accurate printing tool, and (v) selectively etching the printed Cu using hexadecanethiol as a resist. This method is particularly attractive for the fabrication of metallic gates for thin-film transistor liquid-crystal displays. |
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Bibliography: | istex:412B68A2C1D66F53D1B32DCAAEB9D91A4B34E7D9 ark:/67375/TPS-LK50MX6R-H |
ISSN: | 0743-7463 1520-5827 |
DOI: | 10.1021/la034748h |