Emerging Hardware Technologies and 3D System Integration for Ubiquitous Machine Intelligence
Next-generation semiconductor hardware technologies and system integration serve as the physical foundation in the pursuit of ubiquitous machine intelligence, with unprecedented requirements in energy efficiency, performance, cost effectiveness, and security. Here, we provide an overview of emerging...
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Published in | 2023 60th ACM/IEEE Design Automation Conference (DAC) pp. 1 - 2 |
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Main Author | |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
09.07.2023
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Subjects | |
Online Access | Get full text |
DOI | 10.1109/DAC56929.2023.10247990 |
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Abstract | Next-generation semiconductor hardware technologies and system integration serve as the physical foundation in the pursuit of ubiquitous machine intelligence, with unprecedented requirements in energy efficiency, performance, cost effectiveness, and security. Here, we provide an overview of emerging technologies with an emphasis on 3D system integration, and discuss on cross-layer designs for memory-centric computing in the 3D era. |
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AbstractList | Next-generation semiconductor hardware technologies and system integration serve as the physical foundation in the pursuit of ubiquitous machine intelligence, with unprecedented requirements in energy efficiency, performance, cost effectiveness, and security. Here, we provide an overview of emerging technologies with an emphasis on 3D system integration, and discuss on cross-layer designs for memory-centric computing in the 3D era. |
Author | Li, Haitong |
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SubjectTerms | 3D integrated systems artificial intelligence hardware Costs Cross layer design Design automation emerging device technologies Energy efficiency Hardware memory-centric computing System integration Three-dimensional displays |
Title | Emerging Hardware Technologies and 3D System Integration for Ubiquitous Machine Intelligence |
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