Emerging Hardware Technologies and 3D System Integration for Ubiquitous Machine Intelligence

Next-generation semiconductor hardware technologies and system integration serve as the physical foundation in the pursuit of ubiquitous machine intelligence, with unprecedented requirements in energy efficiency, performance, cost effectiveness, and security. Here, we provide an overview of emerging...

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Bibliographic Details
Published in2023 60th ACM/IEEE Design Automation Conference (DAC) pp. 1 - 2
Main Author Li, Haitong
Format Conference Proceeding
LanguageEnglish
Published IEEE 09.07.2023
Subjects
3D integrated systems
artificial intelligence hardware
Costs
Cross layer design
Design automation
emerging device technologies
Energy efficiency
Hardware
memory-centric computing
System integration
Three-dimensional displays
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DOI10.1109/DAC56929.2023.10247990

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Summary:Next-generation semiconductor hardware technologies and system integration serve as the physical foundation in the pursuit of ubiquitous machine intelligence, with unprecedented requirements in energy efficiency, performance, cost effectiveness, and security. Here, we provide an overview of emerging technologies with an emphasis on 3D system integration, and discuss on cross-layer designs for memory-centric computing in the 3D era.
DOI:10.1109/DAC56929.2023.10247990