Statistical delay computation considering spatial correlations

Process variation has become a significant concern for static timing analysis. In this paper, we present a new method for path-based statistical timing analysis. We first propose a method for modeling inter- and intra-die device length variations. Based on this model, we then present an efficient me...

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Bibliographic Details
Published inProceedings of the 2003 Asia and South Pacific Design Automation Conference pp. 271 - 276
Main Authors Agarwal, Aseem, Blaauw, David, Zolotov, Vladimir, Sundareswaran, Savithri, Zhao, Min, Gala, Kaushik, Panda, Rajendran
Format Conference Proceeding
LanguageEnglish
Published New York, NY, USA ACM 21.01.2003
SeriesACM Conferences
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Summary:Process variation has become a significant concern for static timing analysis. In this paper, we present a new method for path-based statistical timing analysis. We first propose a method for modeling inter- and intra-die device length variations. Based on this model, we then present an efficient method for computing the total path delay probability distribution using a combination of device length enumeration for inter-die variation and an analytical approach for intra-die variation. We also propose a simple and effective model of spatial correlation of intra-die device length variation. The analysis is then extended to include spatial correlation. We test the proposed methods on paths from an industrial high-performance microprocessor and present comparisons with traditional path analysis which does not distinguish between inter- and intra-die variations. The characteristics of the device length distributions were obtained from measured data of 8 test chips with a total of 17688 device length measurements. Spatial correlation data was also obtained from these measurements. We demonstrate the accuracy of the proposed approach by comparing our results with Monte-Carlo simulation.
Bibliography:SourceType-Conference Papers & Proceedings-1
ObjectType-Conference Paper-1
content type line 25
ISBN:0780376609
9780780376601
DOI:10.1145/1119772.1119825