Thermal Transport in Pentagonal CX2 (X = N, P, As, and Sb)

Two-dimensional (2D) materials with a pentagonal structure have many unique physical properties and great potential for applications in electrical, thermal, and optical fields. In this paper, the intrinsic thermal transport properties of 2D pentagonal CX2 (X = N, P, As, and Sb) are comparatively inv...

Full description

Saved in:
Bibliographic Details
Published inLangmuir Vol. 40; no. 15; pp. 7992 - 8001
Main Authors Wang, Ning, Gan, Siyu, Wei, Qinqin, He, Guiling, Chen, Xihao, Ji, Yupin, Wang, Shijian, Wang, Guangzhao, Shen, Chen
Format Journal Article
LanguageEnglish
Published American Chemical Society 16.04.2024
Online AccessGet full text

Cover

Loading…
More Information
Summary:Two-dimensional (2D) materials with a pentagonal structure have many unique physical properties and great potential for applications in electrical, thermal, and optical fields. In this paper, the intrinsic thermal transport properties of 2D pentagonal CX2 (X = N, P, As, and Sb) are comparatively investigated. The results show that penta-CN2 has a high thermal conductivity (302.7 W/mK), while penta-CP2, penta-CAs2, and penta-CSb2 have relatively low thermal conductivities of 60.0, 36.9, and 11.8 W/mK, respectively. The main reason for the high thermal conductivity of penta-CN2 is that the small atomic mass of the N atom is comparable to that of the C atom, resulting in a preferable pentagonal structure with stronger bonds and thus a higher phonon group velocity. The reduction in the thermal conductivity of the other three materials is mainly due to the gradually increased atomic mass from P to Sb, which reduces the phonon group velocity. In addition, the large atomic mass difference does not result in a huge enhancement of the anharmonicity or weakening of the phonon relaxation time. The present work is expected to deepen the understanding of the thermal transport of main group V 2D pentagonal carbons and pave the way for their future applications, also, providing ideas for finding potential thermal management materials.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0743-7463
1520-5827
DOI:10.1021/acs.langmuir.3c03948