Statistical thermal modeling and optimization considering leakage power variations

• Published in: Proceedings of the Conference on Design, Automation and Test in Europe pp. 605 - 610
• Main Authors: Juan, Da-Cheng, Chuang, Yi-Lin, Marculescu, Diana, Chang, Yao-Wen
• Format: Conference Proceeding
• Language: English
• Published: San Jose, CA, USA EDA Consortium 12.03.2012
• Series: ACM Conferences
• Subjects: Computing methodologies > Modeling and simulation > Model development and analysis; Hardware > Hardware test; Hardware > Hardware validation; Hardware > Robustness
• ISBN: 3981080181; 9783981080186
• DOI: 10.5555/2492708.2492862

Unaddressed thermal issues can seriously hinder the development of reliable and low power systems. In this paper, we propose a statistical approach for analyzing thermal behavior under leakage power variations stemming from the manufacturing process. Based on the proposed models, we develop floorplanning techniques targeting thermal optimization. The experimental results show that peak temperature is reduced by up to 8.8°C, while thermal-induced leakage power and maximum thermal variance are reduced by 13% and 17%, respectively, with no additional area overhead compared with best performance-driven optimized design.