Testing of interposer-based 2.5D integrated circuits

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...

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Bibliographic Details
Main Authors Wang, Ran (Author), Chakrabarty, Krishnendu (Author)
Format Electronic eBook
LanguageEnglish
Published Cham, Switzerland : Springer, 2017.
Subjects
Online AccessPlný text

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