Testing of interposer-based 2.5D integrated circuits
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...
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Main Authors | , |
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Format | Electronic eBook |
Language | English |
Published |
Cham, Switzerland :
Springer,
2017.
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Subjects | |
Online Access | Plný text |
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