3D microelectronic packaging : from fundamentals to applications

• Other Authors: Li, Yan (Editor), Goyal, Deepak (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham, Switzerland : Springer, [2017]
• Series: Springer series in advanced microelectronics ; 57.
• Subjects: Microelectronics > Packaging.; elektronické knihy; electronic books

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...