Recent advances in adhesion : proceedings of the American Chemical Society Symposium on Recent Advances in Adhesion, Washington D.C., September 1971

• Corporate Authors: Symposium on Recent Advances in Adhesion Washington, D.C., American Chemical Society
• Other Authors: Lee, Lieng-Huang, 1924- (Editor)
• Format: Book
• Language: English
• Published: London : Gordon and Breach, 1973
• Subjects: lepidla; lepení; fyzikální vlastnosti materiálů; adhesion; gluing; physical properties of materials; sborníky konferencí; proceedings of conferences