界面改性对复合材料介电性能研究进展

TQ317.5%TB34; 论述了由于纳米填料与高聚物界面之间存在分散性和相容性问题,使得填料在高聚物中存在团聚现象,导致界面出现空隙或缺陷,从而增加复合材料损耗,影响其性能.为解决以上问题,研究者提出了对填料进行界面改性,以减少填料和聚合物两者之间表面能的差异,主要通过偶联剂改性纳米粒子、高分子包覆纳米粒子、在纳米颗粒表面接枝聚合等三种较为常见的方式提高纳米填料与高聚物的相容性,使得填料在高聚物中分散均匀,从而减少填料团聚,以提高高聚物的介电性能....

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Published in应用化工 Vol. 51; no. 7; pp. 2139 - 2142
Main Authors 王延东, 蔡会武, 强悦悦, 苏鹏程, 路卫卫, 刘畅, 石凯, 杜月, 陈守丽
Format Journal Article
LanguageChinese
Published 西安科技大学 化学与化工学院,陕西 西安 710054 2022
Subjects
Online AccessGet full text
ISSN1671-3206
DOI10.3969/j.issn.1671-3206.2022.07.054

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Abstract TQ317.5%TB34; 论述了由于纳米填料与高聚物界面之间存在分散性和相容性问题,使得填料在高聚物中存在团聚现象,导致界面出现空隙或缺陷,从而增加复合材料损耗,影响其性能.为解决以上问题,研究者提出了对填料进行界面改性,以减少填料和聚合物两者之间表面能的差异,主要通过偶联剂改性纳米粒子、高分子包覆纳米粒子、在纳米颗粒表面接枝聚合等三种较为常见的方式提高纳米填料与高聚物的相容性,使得填料在高聚物中分散均匀,从而减少填料团聚,以提高高聚物的介电性能.
AbstractList TQ317.5%TB34; 论述了由于纳米填料与高聚物界面之间存在分散性和相容性问题,使得填料在高聚物中存在团聚现象,导致界面出现空隙或缺陷,从而增加复合材料损耗,影响其性能.为解决以上问题,研究者提出了对填料进行界面改性,以减少填料和聚合物两者之间表面能的差异,主要通过偶联剂改性纳米粒子、高分子包覆纳米粒子、在纳米颗粒表面接枝聚合等三种较为常见的方式提高纳米填料与高聚物的相容性,使得填料在高聚物中分散均匀,从而减少填料团聚,以提高高聚物的介电性能.
Author 蔡会武
路卫卫
杜月
石凯
陈守丽
苏鹏程
刘畅
强悦悦
王延东
AuthorAffiliation 西安科技大学 化学与化工学院,陕西 西安 710054
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QIANG Yue-yue
SHI Kai
LU Wei-wei
CHEN Shou-li
WANG Yan-dong
SU Peng-cheng
LIU Chang
DU Yue
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