杨贺, 张立文, 杨陈, 王金婵, & 曹磊. (2023). 基于混合介质的同轴-环形TSV传输特性分析. 电子元件与材料, 42(1), 110-117. https://doi.org/10.14106/j.cnki.1001-2028.2023.1306
Chicago Style (17th ed.) Citation杨贺, 张立文, 杨陈, 王金婵, and 曹磊. "基于混合介质的同轴-环形TSV传输特性分析." 电子元件与材料 42, no. 1 (2023): 110-117. https://doi.org/10.14106/j.cnki.1001-2028.2023.1306.
MLA (9th ed.) Citation杨贺, et al. "基于混合介质的同轴-环形TSV传输特性分析." 电子元件与材料, vol. 42, no. 1, 2023, pp. 110-117, https://doi.org/10.14106/j.cnki.1001-2028.2023.1306.
Warning: These citations may not always be 100% accurate.