基于Unity3D的卷绕机半物理仿真系统研究 - 唐龙; 邹鲲 (东华大学学报（英文版）, 2024)
Keywords: Unity3D; winding machine; 仿真电路板; process simulation; 实时性; 三维展示; three-dimensional(3D)display; 卷绕机; 半物理仿真; 工艺仿真; simulation circuit board; hardware-in-the-loop simulation(HILS); real time