Reflow apparatus, reflow method, and package apparatus
Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The s...
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| Main Authors | , , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
04.12.2012
|
| Online Access | Get full text |
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