Reflow apparatus, reflow method, and package apparatus

Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The s...

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Main Authors Kim, Minill, Lee, Kwang Yong, Lee, Jonggi, Hong, Ji-Seok
Format Patent
LanguageEnglish
Published 04.12.2012
Online AccessGet full text

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Abstract Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.
AbstractList Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.
Author Kim, Minill
Lee, Kwang Yong
Hong, Ji-Seok
Lee, Jonggi
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References (10-2008-0043401) 20080500
Matsuura et al. (2007/0023486) 20070200
(2005-267863) 20050900
(2007-142343) 20070600
Galli (3724068) 19730400
(10-0517010) 20050900
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Snippet Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support...
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Title Reflow apparatus, reflow method, and package apparatus
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