Self-assembled electrical contacts
Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprisin...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
27.11.2012
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Online Access | Get full text |
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Abstract | Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprising a solder alloy positioned on the metallization layer, wherein the solder alloy is liquefied to allow the bump structure to self-assemble and align with the part electrical binding site using capillary forces, and wherein the solder alloy only liquefies at a temperature above that at which the self-assembly and alignment is performed; and a fluid on the template electrical conductor layer, wherein the fluid comprises a melting point lower than that of the solder alloy, wherein the fluid binds with the part binding site. |
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AbstractList | Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprising a solder alloy positioned on the metallization layer, wherein the solder alloy is liquefied to allow the bump structure to self-assemble and align with the part electrical binding site using capillary forces, and wherein the solder alloy only liquefies at a temperature above that at which the self-assembly and alignment is performed; and a fluid on the template electrical conductor layer, wherein the fluid comprises a melting point lower than that of the solder alloy, wherein the fluid binds with the part binding site. |
Author | Morris, Christopher J Dubey, Mandan |
Author_xml | – sequence: 1 givenname: Christopher J surname: Morris fullname: Morris, Christopher J – sequence: 2 givenname: Mandan surname: Dubey fullname: Dubey, Mandan |
BookMark | eNrjYmDJy89L5WRQCk7NSdNNLC5OzU3KSU1RSM1JTS4pykxOzFFIzs8rSUwuKeZhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMLY0MLU0tSYCCUAepIo4Q |
ContentType | Patent |
CorporateAuthor | The United States of America as represented by the Secretary of the Army |
CorporateAuthor_xml | – name: The United States of America as represented by the Secretary of the Army |
DBID | EFH |
DatabaseName | USPTO Issued Patents |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EFH name: USPTO Issued Patents url: http://www.uspto.gov/patft/index.html sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
ExternalDocumentID | 08318595 |
GroupedDBID | EFH |
ID | FETCH-uspatents_grants_083185953 |
IEDL.DBID | EFH |
IngestDate | Sun Mar 05 22:31:09 EST 2023 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-uspatents_grants_083185953 |
OpenAccessLink | https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8318595 |
ParticipantIDs | uspatents_grants_08318595 |
PatentNumber | 8318595 |
PublicationCentury | 2000 |
PublicationDate | 20121127 |
PublicationDateYYYYMMDD | 2012-11-27 |
PublicationDate_xml | – month: 11 year: 2012 text: 20121127 day: 27 |
PublicationDecade | 2010 |
PublicationYear | 2012 |
References | Tomita et al. (7754529) 20100700 |
References_xml | – year: 20100700 ident: 7754529 contributor: fullname: Tomita et al. |
Score | 2.8758235 |
Snippet | Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site... |
SourceID | uspatents |
SourceType | Open Access Repository |
Title | Self-assembled electrical contacts |
URI | https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8318595 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1NSwMxEB3aImhPior1i0W8RtNsUrNn6bIISkGF3ko2mXjZbks3xb_vZLcUL3pNYPLFZGbCey8A92NpXcZ1GWGDEya1R2a4M0yUnooN4f0Y49PA69uk-JQvczXvQbHnwizJjdia5tI8bJt1WLXgSrreu4Nnnfhz1Aiso_rAd12tjJs5_6gjDThTfehrHqFd07wYwiGZoJStDs2voJEfw8GsbT2BHtancPeOlWeUq-KyrNAl3Qc0cY-SiBc3NjRnkOTTj-eC7Q0uvjYRqLLgu4HTcxhQwY4XkAibKm6NVEaiJAc2Dn2Waqey1KI2bgSjP81c_tN3BUcUrkVkwomnaxiEzRZvKCSG8rZd7w8ioGyW |
link.rule.ids | 230,309,786,808,891,64394 |
linkProvider | USPTO |
linkToPdf | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8MwDLbGQDxOIEDbeFWIa6BL0609w6rymioB0m5V2jhcum5aO_H3sVs0cYFrIjkvOZ8dff4CcDNUuQndIGPa4EiowKLQrtFCZpaSDWntEPlp4HU6ij_U08yfdSDe1MLMyY3EkuZS3a6rZb1oyJV0vbcHL1rxZ9YILFl94KssFtokxt4FXAYc-luwzRjLKvqTKD6APTJCQVtZV79gIzqEnaRpPYIOlsdw_YaFFRSt4jwr0DjtFzS8Sw4zxnVeVyfgRJP3-1hsDKafK6aqpO7P0N4pdCllxx44Mvd8N9fK1woVubA2aEMvMH7o5Rho04f-n2YG__RdwW7yEKUvj9PnM9gn7JZcFifH59CtV2u8IHyss8tm6d-izG-Q |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Self-assembled+electrical+contacts&rft.inventor=Morris%2C+Christopher+J&rft.inventor=Dubey%2C+Mandan&rft.number=8318595&rft.date=2012-11-27&rft.externalDBID=n%2Fa&rft.externalDocID=08318595 |