Wafer center finding with charge-coupled devices
A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substanti...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
28.08.2012
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Online Access | Get full text |
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Abstract | A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances. |
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AbstractList | A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances. |
Author | Buzan, Forrest T van der Meulen, Peter Fogel, Paul E Kiley, Christopher C |
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References | Nangoy (7433759) 20081000 Oppenheimer et al. (5982492) 19991100 Nioonahad et al. (2004/0032581) 20040200 Pasquailini et al. (7591597) 20090900 Del Porto et al. (2003/0082466) 20030500 Fogel (2008/0135788) 20080600 Hofmeister et al. (2004/0067127) 20040400 Lu (2004/0151574) 20040800 Shinichi (6856858) 20050200 Shmookler et al. (5483138) 19960100 Cheng (5546179) 19960800 Cheng et al. (4819167) 19890400 Shimazaki et al. (5917601) 19990600 van der Meulen et al. (2008/0232948) 20080900 Uhlmann (6092033) 20000700 Johanson et al. (6405101) 20020600 Das et al. (6190037) 20010200 Scaduto (6429936) 20020800 Pryor (4570065) 19860200 Yoo et al. (2002/0103571) 20020800 Moy et al. (5331232) 19940700 Kiley et al. (2008/0145194) 20080600 Matsushima (6339730) 20020100 Astegno et al. (2004/0091343) 20040500 Nisson et al. (6476574) 20021100 Mooring et al. (6502054) 20021200 Ramsey et al. (7283255) 20071000 |
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Snippet | A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality... |
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Title | Wafer center finding with charge-coupled devices |
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