Resin composition and metal laminate plate

A resin composition comprises a polyimide resin composition or precursor thereof obtained from an acid dianhydride component containing a compound represented by the following Formula (1) and a diamine component containing a diamine compound represented by the following Formula (2), and a bismaleimi...

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Main Authors Kawaguchi, Masao, Imagawa, Kiyomi, Tahara, Shuji, Ohtsubo, Eiji
Format Patent
LanguageEnglish
Published 08.05.2012
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Abstract A resin composition comprises a polyimide resin composition or precursor thereof obtained from an acid dianhydride component containing a compound represented by the following Formula (1) and a diamine component containing a diamine compound represented by the following Formula (2), and a bismaleimide compound represented by the following Formula (3),
AbstractList A resin composition comprises a polyimide resin composition or precursor thereof obtained from an acid dianhydride component containing a compound represented by the following Formula (1) and a diamine component containing a diamine compound represented by the following Formula (2), and a bismaleimide compound represented by the following Formula (3),
Author Tahara, Shuji
Kawaguchi, Masao
Imagawa, Kiyomi
Ohtsubo, Eiji
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References (6-192639) 19940700
(11-35902) 19990200
(2001-007464) 20010100
PCT/ISA/237, 2005.
Oka et al. (6132865) 20001000
(2001-6437) 20010100
Kodama et al. (2004/0096679) 20040500
(6-145638) 19940500
Office Action from Japanese Patent Office issued in Applicant's corresponding Japanese Patent Application No. 2005-077412 dated Sep. 7, 2010, with English translation.
PCT/ISA/210, 2005.
(2004-209962) 20040700
(2006-104337) 20060400
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