Light emitting diode package and fabrication method thereof

• Main Authors: Han, Kyung Taeg, Yeo, In Tae, Hahm, Hun Joo, Song, Chang Ho, Han, Seong Yeon, Na, Yoon Sung, Kim, Dae Yeon, Ahn, Ho Sik, Park, Young Sam
• Format: Patent
• Language: English
• Published: 01.05.2012

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes...