Manufacturing method of wiring board
A manufacturing method of a wiring board includes a sticking layer forming step; a resist film forming step of forming a resist film on an upper surface of the sticking layer, the resist film having an opening exposing the upper surface of the sticking layer; a metal layer forming step of forming a...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
29.11.2011
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Online Access | Get full text |
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