Integrated circuit devices with stacked package interposers

• Main Authors: Chye, Chew Beng, Michael, Tan Kian Shing, Chuan, Tan Hock, Peng, Neo Chee
• Format: Patent
• Language: English
• Published: 15.11.2011

An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the d...