Integrated shield for a no-lead semiconductor device package

• Main Authors: Swan, Geoff, Warren, Jr, Waite R
• Format: Patent
• Language: English
• Published: 08.11.2011

The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one inner row and one outer row of contact pads on at least one side. The inner and outer rows of contact p...