Integrated shield for a no-lead semiconductor device package

The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one inner row and one outer row of contact pads on at least one side. The inner and outer rows of contact p...

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Main Authors Swan, Geoff, Warren, Jr, Waite R
Format Patent
LanguageEnglish
Published 08.11.2011
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Abstract The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one inner row and one outer row of contact pads on at least one side. The inner and outer rows of contact pads and a die attach pad form the foundation for the FN semiconductor package. A die is mounted on the die attach pad and connected by wirebonds to certain contact pads of the inner rows of contact pads. An overmold body is formed over the die, die attach pad, wirebonds, and inner row of contact pads, and substantially encompasses each contact pad of the outer row of contact pads. A conformal coating is applied over the overmold body, including the exposed surfaces of the contact pads of the outer row of contact pads, providing a shield.
AbstractList The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one inner row and one outer row of contact pads on at least one side. The inner and outer rows of contact pads and a die attach pad form the foundation for the FN semiconductor package. A die is mounted on the die attach pad and connected by wirebonds to certain contact pads of the inner rows of contact pads. An overmold body is formed over the die, die attach pad, wirebonds, and inner row of contact pads, and substantially encompasses each contact pad of the outer row of contact pads. A conformal coating is applied over the overmold body, including the exposed surfaces of the contact pads of the outer row of contact pads, providing a shield.
Author Swan, Geoff
Warren, Jr, Waite R
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References Warner (2005/0046001) 20050300
Degani et al. (5473512) 19951200
(11-163583) 19990600
Seaford et al. (2004/0209434) 20041000
Punzalan et al. (2009/0072364) 20090300
RF Micro Devices, Inc., "Fractional-N RF Synthesizer With Modulator and Digital IF Filter," RF6001, Rev A2, May 6, 2002, 2 pages.
Berry et al. (7342303) 20080300
Piosenka et al. (5389738) 19950200
Chow et al. (2008/0142938) 20080600
Yang (2008/0157316) 20080700
Nuytkens et al. (6838750) 20050100
Fukuzumi (2004/0232536) 20041100
Coffy (2006/0274517) 20061200
MacDonald et al. (6538196) 20030300
(2007-311396) 20071100
Schein et al. (2007/0045248) 20070300
English translation of JP 2005-109306 A to Takase et al., publication date Apr. 25, 2005. Translation available Sep. 20, 2010. Abstract previously submitted Apr. 30, 2009.
Zhao et al. (2007/0290322) 20071200
Koga (7478474) 20090100
Johnson et al. (6297957) 20011000
Wiemer (3907616) 19750900
Mahadevan et al. (7030469) 20060400
Babin et al. (2002/0118529) 20020800
Sjoedin (7665201) 20100200
Glenn (6150193) 20001100
Yang et al. (7633170) 20091200
(2004-207352) 20040700
Ohtomo et al. (6791795) 20040900
Park et al. (2006/0033184) 20060200
(2007132560) 20071100
Dimaano et al. (2008/0054421) 20080300
Harrison et al. (7445968) 20081100
Coffy (7643311) 20100100
Kawagishi et al. (2008/0210462) 20080900
Schwiebert et al. (6137693) 20001000
Non-final Office Action, mailed Dec. 15, 2010, from U.S. Appl. No. 11/952,592.
Usui (2004/0178500) 20040900
(03058812) 20030700
Brown (3566190) 19710200
Walker et al. (6825560) 20041100
Morris et al. (2007/0030661) 20070200
(1715520) 20061000
Tuttle (7902643) 20110300
Nonfinal Office Action mailed Jun. 22, 2011 regarding U.S. Appl. No. 11/952,670.
Farnworth (6887787) 20050500
Yang et al. (7700411) 20100400
Nuytkens et al. (2003/0011049) 20030100
Hoffman et al. (6707168) 20040300
Park et al. (7087461) 20060800
(2006-332255) 20061200
Salzman (7928538) 20110400
(2004019490) 20040300
Usui (7187060) 20070300
Yoneda et al. (6448583) 20010900
Yi et al. (7433203) 20081000
Kirloskar et al. (7348663) 20080300
Takehara et al. (7125744) 20061000
Horio et al. (6590152) 20030700
(2006113412) 20060200
Iseki et al. (2002/0036345) 20020300
Bidard (2004/0103509) 20040600
(2007060784) 20070500
Wang et al. (5977626) 19991100
Farnworth (2004/0104473) 20040600
Cha et al. (2008/0308912) 20081200
Nonfinal Office Action with Requirement for Restriction/Election mailed Jun. 13, 2011 regarding U.S. Appl. No. 11/952,634.
Sasaki et al. (7227719) 20070600
Kobayashi et al. (7514772) 20090400
Mostafazadeh et al. (5650659) 19970700
(0035085) 20000600
Chow et al. (7598606) 20091000
Park et al. (2004/0214023) 20041000
Final Office Action mailed Feb. 24, 2011 regarding U.S. Appl. No. 11/952,592.
Sjoedin (2007/0062637) 20070300
Piosenka et al. (5406630) 19950400
Park et al. (7087462) 20060800
Notice of Allowance mailed Mar. 3, 2011 regarding U.S. Appl. No. 11/952,634.
Petratos et al. (4680676) 19870700
Nonfinal Office Action mailed May 10, 2011 regarding U.S. Appl. No. 11/952,513.
Kawamoto et al. (6998532) 20060200
Honjo et al. (6466416) 20021000
Tang (7042398) 20060500
Buehler (6011698) 20000100
Krueger et al. (2006/0151203) 20060700
Monthei (2007/0163802) 20070700
Arnold et al. (7443693) 20081000
Knall et al. (6004180) 19991200
Rezvani et al. (6633073) 20031000
International Search Report for PCT/US2008/068153, mailed Dec. 9, 2008.
Final Office Action, mailed Dec. 23, 2010, from U.S. Appl. No. 11/952,634.
Higgins (5639989) 19970600
(1717857) 20061100
Onishi et al. (5459368) 19951000
Warner et al. (2004/0238934) 20041200
Yang (2008/0224306) 20080900
Strickler (6163454) 20001200
Dening et al. (6657592) 20031200
(2005109306) 20050400
Kawagishi et al. (7488903) 20090200
Lee et al. (7671451) 20100300
Kahlert et al. (6613660) 20030900
Ohtomo et al. (2003/0048581) 20030300
Nuytkens et al. (2005/0153061) 20050700
Barratt et al. (6448793) 20020900
Stelzl et al. (7259041) 20070800
Shim et al. (6599779) 20030700
Degani et al. (5646828) 19970700
Kolb et al. (6717485) 20040400
McLellan et al. (6946324) 20050900
Yoshida (7635918) 20091200
(1855451) 20061100
Ohtani (2009/0140402) 20090600
Kobayashi et al. (2006/0244131) 20061100
Morris et al. (7451539) 20081100
Brandenburg et al. (6807731) 20041000
Zhao et al. (2007/0200210) 20070800
Warner (2003/0062541) 20030400
(2005-109306) 20050400
(2005-039007) 20050200
Nonfinal Office Action mailed Jul. 28, 2011 regarding U.S. Appl. No. 11/952,617.
Chomerics, "Cho-Shield Conductive Coatings," Chomerics.
(2004060034) 20040700
(1764834) 20090300
Hatanaka et al. (2008/0019112) 20080100
Kolb (7109817) 20060900
References_xml – year: 20100400
  ident: 7700411
  contributor:
    fullname: Yang et al.
– year: 19951000
  ident: 5459368
  contributor:
    fullname: Onishi et al.
– year: 20090200
  ident: 7488903
  contributor:
    fullname: Kawagishi et al.
– year: 20061100
  ident: 1717857
– year: 19991100
  ident: 5977626
  contributor:
    fullname: Wang et al.
– year: 20000100
  ident: 6011698
  contributor:
    fullname: Buehler
– year: 20060700
  ident: 2006/0151203
  contributor:
    fullname: Krueger et al.
– year: 19990600
  ident: 11-163583
– year: 20080300
  ident: 7342303
  contributor:
    fullname: Berry et al.
– year: 20040700
  ident: 2004060034
– year: 20091200
  ident: 7635918
  contributor:
    fullname: Yoshida
– year: 20041200
  ident: 2004/0238934
  contributor:
    fullname: Warner et al.
– year: 20030300
  ident: 2003/0048581
  contributor:
    fullname: Ohtomo et al.
– year: 20050400
  ident: 2005-109306
– year: 20070600
  ident: 7227719
  contributor:
    fullname: Sasaki et al.
– year: 20050400
  ident: 2005109306
– year: 20060200
  ident: 2006113412
– year: 20020900
  ident: 6448793
  contributor:
    fullname: Barratt et al.
– year: 20100300
  ident: 7671451
  contributor:
    fullname: Lee et al.
– year: 20050100
  ident: 6838750
  contributor:
    fullname: Nuytkens et al.
– year: 19970600
  ident: 5639989
  contributor:
    fullname: Higgins
– year: 19870700
  ident: 4680676
  contributor:
    fullname: Petratos et al.
– year: 20080300
  ident: 7348663
  contributor:
    fullname: Kirloskar et al.
– year: 20080900
  ident: 2008/0224306
  contributor:
    fullname: Yang
– year: 19970700
  ident: 5650659
  contributor:
    fullname: Mostafazadeh et al.
– year: 20110400
  ident: 7928538
  contributor:
    fullname: Salzman
– year: 20001100
  ident: 6150193
  contributor:
    fullname: Glenn
– year: 20090400
  ident: 7514772
  contributor:
    fullname: Kobayashi et al.
– year: 19950400
  ident: 5406630
  contributor:
    fullname: Piosenka et al.
– year: 20081000
  ident: 7433203
  contributor:
    fullname: Yi et al.
– year: 20081000
  ident: 7443693
  contributor:
    fullname: Arnold et al.
– year: 20070700
  ident: 2007/0163802
  contributor:
    fullname: Monthei
– year: 20070300
  ident: 7187060
  contributor:
    fullname: Usui
– year: 20100100
  ident: 7643311
  contributor:
    fullname: Coffy
– year: 20080600
  ident: 2008/0142938
  contributor:
    fullname: Chow et al.
– year: 20040700
  ident: 2004-207352
– year: 20071200
  ident: 2007/0290322
  contributor:
    fullname: Zhao et al.
– year: 20040600
  ident: 2004/0103509
  contributor:
    fullname: Bidard
– year: 20090300
  ident: 2009/0072364
  contributor:
    fullname: Punzalan et al.
– year: 20040600
  ident: 2004/0104473
  contributor:
    fullname: Farnworth
– year: 20080900
  ident: 2008/0210462
  contributor:
    fullname: Kawagishi et al.
– year: 20041000
  ident: 2004/0214023
  contributor:
    fullname: Park et al.
– year: 20010900
  ident: 6448583
  contributor:
    fullname: Yoneda et al.
– year: 20020300
  ident: 2002/0036345
  contributor:
    fullname: Iseki et al.
– year: 20070300
  ident: 2007/0045248
  contributor:
    fullname: Schein et al.
– year: 20100200
  ident: 7665201
  contributor:
    fullname: Sjoedin
– year: 20001200
  ident: 6163454
  contributor:
    fullname: Strickler
– year: 20031000
  ident: 6633073
  contributor:
    fullname: Rezvani et al.
– year: 20060800
  ident: 7087461
  contributor:
    fullname: Park et al.
– year: 20050200
  ident: 2005-039007
– year: 20060200
  ident: 6998532
  contributor:
    fullname: Kawamoto et al.
– year: 20030100
  ident: 2003/0011049
  contributor:
    fullname: Nuytkens et al.
– year: 20070200
  ident: 2007/0030661
  contributor:
    fullname: Morris et al.
– year: 20050500
  ident: 6887787
  contributor:
    fullname: Farnworth
– year: 20001000
  ident: 6137693
  contributor:
    fullname: Schwiebert et al.
– year: 20030300
  ident: 6538196
  contributor:
    fullname: MacDonald et al.
– year: 20061000
  ident: 7125744
  contributor:
    fullname: Takehara et al.
– year: 20080300
  ident: 2008/0054421
  contributor:
    fullname: Dimaano et al.
– year: 20090300
  ident: 1764834
– year: 20091200
  ident: 7633170
  contributor:
    fullname: Yang et al.
– year: 20040300
  ident: 2004019490
– year: 20040900
  ident: 6791795
  contributor:
    fullname: Ohtomo et al.
– year: 20070800
  ident: 7259041
  contributor:
    fullname: Stelzl et al.
– year: 20030700
  ident: 03058812
– year: 20030900
  ident: 6613660
  contributor:
    fullname: Kahlert et al.
– year: 20021000
  ident: 6466416
  contributor:
    fullname: Honjo et al.
– year: 20031200
  ident: 6657592
  contributor:
    fullname: Dening et al.
– year: 20060400
  ident: 7030469
  contributor:
    fullname: Mahadevan et al.
– year: 20071100
  ident: 2007132560
– year: 20040400
  ident: 6717485
  contributor:
    fullname: Kolb et al.
– year: 20070300
  ident: 2007/0062637
  contributor:
    fullname: Sjoedin
– year: 20061100
  ident: 1855451
– year: 20061200
  ident: 2006-332255
– year: 20060800
  ident: 7087462
  contributor:
    fullname: Park et al.
– year: 20060200
  ident: 2006/0033184
  contributor:
    fullname: Park et al.
– year: 20041000
  ident: 2004/0209434
  contributor:
    fullname: Seaford et al.
– year: 20000600
  ident: 0035085
– year: 20040300
  ident: 6707168
  contributor:
    fullname: Hoffman et al.
– year: 20091000
  ident: 7598606
  contributor:
    fullname: Chow et al.
– year: 20071100
  ident: 2007-311396
– year: 20061200
  ident: 2006/0274517
  contributor:
    fullname: Coffy
– year: 20020800
  ident: 2002/0118529
  contributor:
    fullname: Babin et al.
– year: 20030700
  ident: 6590152
  contributor:
    fullname: Horio et al.
– year: 20081200
  ident: 2008/0308912
  contributor:
    fullname: Cha et al.
– year: 20090100
  ident: 7478474
  contributor:
    fullname: Koga
– year: 20060500
  ident: 7042398
  contributor:
    fullname: Tang
– year: 20061000
  ident: 1715520
– year: 20041000
  ident: 6807731
  contributor:
    fullname: Brandenburg et al.
– year: 19951200
  ident: 5473512
  contributor:
    fullname: Degani et al.
– year: 20030400
  ident: 2003/0062541
  contributor:
    fullname: Warner
– year: 20080100
  ident: 2008/0019112
  contributor:
    fullname: Hatanaka et al.
– year: 20070800
  ident: 2007/0200210
  contributor:
    fullname: Zhao et al.
– year: 20030700
  ident: 6599779
  contributor:
    fullname: Shim et al.
– year: 20070500
  ident: 2007060784
– year: 19991200
  ident: 6004180
  contributor:
    fullname: Knall et al.
– year: 20090600
  ident: 2009/0140402
  contributor:
    fullname: Ohtani
– year: 19950200
  ident: 5389738
  contributor:
    fullname: Piosenka et al.
– year: 20050300
  ident: 2005/0046001
  contributor:
    fullname: Warner
– year: 19710200
  ident: 3566190
  contributor:
    fullname: Brown
– year: 20041100
  ident: 2004/0232536
  contributor:
    fullname: Fukuzumi
– year: 20050900
  ident: 6946324
  contributor:
    fullname: McLellan et al.
– year: 20110300
  ident: 7902643
  contributor:
    fullname: Tuttle
– year: 20081100
  ident: 7451539
  contributor:
    fullname: Morris et al.
– year: 19750900
  ident: 3907616
  contributor:
    fullname: Wiemer
– year: 20040900
  ident: 2004/0178500
  contributor:
    fullname: Usui
– year: 20050700
  ident: 2005/0153061
  contributor:
    fullname: Nuytkens et al.
– year: 20081100
  ident: 7445968
  contributor:
    fullname: Harrison et al.
– year: 20041100
  ident: 6825560
  contributor:
    fullname: Walker et al.
– year: 20060900
  ident: 7109817
  contributor:
    fullname: Kolb
– year: 20061100
  ident: 2006/0244131
  contributor:
    fullname: Kobayashi et al.
– year: 20011000
  ident: 6297957
  contributor:
    fullname: Johnson et al.
– year: 20080700
  ident: 2008/0157316
  contributor:
    fullname: Yang
– year: 19970700
  ident: 5646828
  contributor:
    fullname: Degani et al.
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Snippet The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN...
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