Ultra wideband system-on-package

This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and inc...

Full description

Saved in:
Bibliographic Details
Main Authors Ju, In-Kwon, Yom, In-Bok, Lee, Ho-Jin
Format Patent
LanguageEnglish
Published 01.11.2011
Online AccessGet full text

Cover

Abstract This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.
AbstractList This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.
Author Lee, Ho-Jin
Ju, In-Kwon
Yom, In-Bok
Author_xml – sequence: 1
  givenname: In-Kwon
  surname: Ju
  fullname: Ju, In-Kwon
– sequence: 2
  givenname: In-Bok
  surname: Yom
  fullname: Yom, In-Bok
– sequence: 3
  givenname: Ho-Jin
  surname: Lee
  fullname: Lee, Ho-Jin
BookMark eNrjYmDJy89L5WRQCM0pKUpUKM9MSU1KzEtRKK4sLknN1c3P0y1ITM5OTE_lYWBNS8wpTuWF0twMCm6uIc4euqXFBYklqXklxfHpRYkgysDCwMTS2NDSmAglAAvCJ-U
ContentType Patent
CorporateAuthor Electronics and Telecommunications Research Institute
CorporateAuthor_xml – name: Electronics and Telecommunications Research Institute
DBID EFH
DatabaseName USPTO Issued Patents
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EFH
  name: USPTO Issued Patents
  url: http://www.uspto.gov/patft/index.html
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 08049319
GroupedDBID EFH
ID FETCH-uspatents_grants_080493193
IEDL.DBID EFH
IngestDate Sun Mar 05 22:32:58 EST 2023
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-uspatents_grants_080493193
OpenAccessLink https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8049319
ParticipantIDs uspatents_grants_08049319
PatentNumber 8049319
PublicationCentury 2000
PublicationDate 20111101
PublicationDateYYYYMMDD 2011-11-01
PublicationDate_xml – month: 11
  year: 2011
  text: 20111101
  day: 01
PublicationDecade 2010
PublicationYear 2011
References Tilmans et al. (6876056) 20050400
Akerling et al. (6936913) 20050800
Wakabayashi et al. (7804688) 20100900
Edris et al. (2009/0129422) 20090500
Kanno et al. (2006/0291110) 20061200
Chen (7838967) 20101100
Ki Seok Yang et al., "Low-Loss Integrated-Waveguide Passive Circuits Using Liquid-Crystal Polymer System-on-Package (SOP) Technology for Millimeter-Wave Applications", IEEE Transactions on Microwave Theory and Techniques, Dec. 2006, pp. 4572-4579, vol. 54, No. 12.
Nakamura (2010/0314714) 20101200
Wakabayashi et al. (2007/0177357) 20070800
Hsu et al. (2009/0219668) 20090900
Nishio et al. (2008/0203554) 20080800
Chang et al. (2008/0157284) 20080700
Pan et al. (2009/0180225) 20090700
Lu et al. (2009/0034206) 20090200
Christensen et al. (7727887) 20100600
Suh et al. (2008/0185718) 20080800
Inkwon Ju et al., "High Performance Vertical Transition from DC to 70 GHz for System-on-Package Applications", Proceedings of the 38th European Microwave Conference, Oct. 30, 2008, pp. 1338-1341, EuMA, Amsterdam, The Netherlands.
Jeong et al. (7119425) 20061000
Montoriol et al. (2008/0142935) 20080600
Han (7727807) 20100600
Ishino et al. (7531905) 20090500
Chrysler et al. (7622327) 20091100
Hoang et al. (7786563) 20100800
Fukuo et al. (2007/0231970) 20071000
Asai et al. (2010/0135611) 20100600
Choi et al. (7868462) 20110100
Kim et al. (2007/0285211) 20071200
References_xml – year: 20080600
  ident: 2008/0142935
  contributor:
    fullname: Montoriol et al.
– year: 20090500
  ident: 2009/0129422
  contributor:
    fullname: Edris et al.
– year: 20090200
  ident: 2009/0034206
  contributor:
    fullname: Lu et al.
– year: 20100800
  ident: 7786563
  contributor:
    fullname: Hoang et al.
– year: 20061000
  ident: 7119425
  contributor:
    fullname: Jeong et al.
– year: 20070800
  ident: 2007/0177357
  contributor:
    fullname: Wakabayashi et al.
– year: 20100900
  ident: 7804688
  contributor:
    fullname: Wakabayashi et al.
– year: 20080700
  ident: 2008/0157284
  contributor:
    fullname: Chang et al.
– year: 20080800
  ident: 2008/0203554
  contributor:
    fullname: Nishio et al.
– year: 20101100
  ident: 7838967
  contributor:
    fullname: Chen
– year: 20071200
  ident: 2007/0285211
  contributor:
    fullname: Kim et al.
– year: 20090900
  ident: 2009/0219668
  contributor:
    fullname: Hsu et al.
– year: 20100600
  ident: 2010/0135611
  contributor:
    fullname: Asai et al.
– year: 20071000
  ident: 2007/0231970
  contributor:
    fullname: Fukuo et al.
– year: 20080800
  ident: 2008/0185718
  contributor:
    fullname: Suh et al.
– year: 20100600
  ident: 7727887
  contributor:
    fullname: Christensen et al.
– year: 20100600
  ident: 7727807
  contributor:
    fullname: Han
– year: 20110100
  ident: 7868462
  contributor:
    fullname: Choi et al.
– year: 20050400
  ident: 6876056
  contributor:
    fullname: Tilmans et al.
– year: 20091100
  ident: 7622327
  contributor:
    fullname: Chrysler et al.
– year: 20050800
  ident: 6936913
  contributor:
    fullname: Akerling et al.
– year: 20061200
  ident: 2006/0291110
  contributor:
    fullname: Kanno et al.
– year: 20090500
  ident: 7531905
  contributor:
    fullname: Ishino et al.
– year: 20101200
  ident: 2010/0314714
  contributor:
    fullname: Nakamura
– year: 20090700
  ident: 2009/0180225
  contributor:
    fullname: Pan et al.
Score 2.831638
Snippet This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a...
SourceID uspatents
SourceType Open Access Repository
Title Ultra wideband system-on-package
URI https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8049319
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfVxLSwMxEB5qEdSTomJ9kYPX6NZNsrvn0mURlB4s9FbyWhFrtuym9O87yUrxUq8JTCaEeXzhmw_gIVM8FblIqJRMUDauGS1qoekzt0Zj-VRZBIqvb6Kas5cFXwyg2s3CfGMY0TX60j1uurVvIrkS03v_8LQXfw4agS6oD2zdqpFmZuqnHFvdNOh_HuRJoHZNy-oEjtAEtmzOd3-KRnkKh7O4egYD686BzFe-lWT7aaxC-E56DWXaOIqw9Qv9uQBSTt8nFd2ZW360gaayTH6PTS9hiHDdXgEZW8ELra3BSGCsMCqTpki4DkJa3Fg9gtFeM9f_7N3AcfzPjHNwtzD07cbeYUH06j7e9gdDSWrU
link.rule.ids 230,309,786,808,891,64394
linkProvider USPTO
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfVxLT8MwDLamgXicQIAYzx64BjqapOsZVpXX1AOTdqvyKkJs6dR22t_HSdHEBa6J5DiK7M9fZH8AN7FkER_xkAhBOaHDkpKk5IrcM6MVwqeMPVF8m_BsSp9nbNaDbDMLs8AwIkv0pbldNcu28s2VmN67hyed-LPTCLROfWBt55XQuS7vRljqRk7_c8thrFPRH6fZPuyiESzabNv8go30ALZzv3oIPWOPIJjO21oE609tJBL4oFNRJpUlSFy_0KNjCNLx-0NGNuaKj9o1qhThz8HRCfSRsJtTCIaGs0QpozEWKE20jIVOQqaclBbTRg1g8KeZs3_2rmEnf0yL16fJyzns-c9NPxR3Af22XplLRMdWXvmLfwOupG3O
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Ultra+wideband+system-on-package&rft.inventor=Ju%2C+In-Kwon&rft.inventor=Yom%2C+In-Bok&rft.inventor=Lee%2C+Ho-Jin&rft.number=8049319&rft.date=2011-11-01&rft.externalDBID=n%2Fa&rft.externalDocID=08049319