Processing apparatus
A processing method of subjecting at least two stacked films, which comprise a first film and a second film of a target object to be processed, to a removing process by wet etching comprises bringing a first process liquid into contact with the first film of the target object, thereby etching the fi...
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Format | Patent |
Language | English |
Published |
25.10.2011
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Abstract | A processing method of subjecting at least two stacked films, which comprise a first film and a second film of a target object to be processed, to a removing process by wet etching comprises bringing a first process liquid into contact with the first film of the target object, thereby etching the first film, determining whether the first film has been removed or not, switching the first process liquid to a second process liquid differing in a condition from the first process liquid when it has been determined that the first film has been removed, and bringing the second process liquid into contact with the second film, thereby etching the second film. |
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AbstractList | A processing method of subjecting at least two stacked films, which comprise a first film and a second film of a target object to be processed, to a removing process by wet etching comprises bringing a first process liquid into contact with the first film of the target object, thereby etching the first film, determining whether the first film has been removed or not, switching the first process liquid to a second process liquid differing in a condition from the first process liquid when it has been determined that the first film has been removed, and bringing the second process liquid into contact with the second film, thereby etching the second film. |
Author | Gale, Glenn |
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References | Niuya et al. (2006/0163205) 20060700 (2004-179583) 20040600 Japanese Office Action; Japanese patent Application No. 2004-304471; dated Dec. 8, 2009. Aoki (6178975) 20010100 Yanagita et al. (6653206) 20031100 Tsurusaki et al. (2006/0060232) 20060300 (2004179583) 20040600 Kamikawa (6510859) 20030100 Toshima et al. (2002/0155709) 20021000 Gale (2006/0088959) 20060400 Machine Generated English Translation of JP 2004-179583, published Jun. 24, 2004. Niuya et al. (6979655) 20051200 (09-143761) 19970600 Gale (2009/0011523) 20090100 Couteau et al. (6326313) 20011200 Nam et al. (6686239) 20040200 |
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Snippet | A processing method of subjecting at least two stacked films, which comprise a first film and a second film of a target object to be processed, to a removing... |
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