Wiring structure between steps and wiring method thereof
In a wiring structure between steps in which a step portion is covered by an insulating slope formed by providing and drying droplets of an insulating ink in which an insulating material is dispersed in a dispersion medium and a wiring line formed by drying and firing provided droplets of a conducti...
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| Main Author | |
|---|---|
| Format | Patent |
| Language | English |
| Published |
06.09.2011
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| Online Access | Get full text |
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