Method of assembling semiconductor device with heat spreader

A method for packaging a semiconductor die or assembling a semiconductor device that includes a heat spreader begins with attaching the heat spreader to a film and dispensing a mold compound in granular form onto the film such that the mold compound at least partially covers the film and the heat sp...

Full description

Saved in:
Bibliographic Details
Main Authors Ibrahim, Ruzaini, Teng, Seng Kiong
Format Patent
LanguageEnglish
Published 06.09.2011
Online AccessGet full text

Cover

Abstract A method for packaging a semiconductor die or assembling a semiconductor device that includes a heat spreader begins with attaching the heat spreader to a film and dispensing a mold compound in granular form onto the film such that the mold compound at least partially covers the film and the heat spreader. The film with the attached heat spreader is placed in a first mold section. A substrate having a semiconductor die attached and electrically coupled to it are placed in a second mold section and then the first and second mold sections are mated such that the die is covered by the heat spreader. The granular mold compound is then melted so that the mold compound covers the die and sides of the heat spreader. The first and second mold sections then are separated. The film, which adheres to the substrate, is removed to expose a top surface of the heat spreader, and thus a semiconductor device is formed.
AbstractList A method for packaging a semiconductor die or assembling a semiconductor device that includes a heat spreader begins with attaching the heat spreader to a film and dispensing a mold compound in granular form onto the film such that the mold compound at least partially covers the film and the heat spreader. The film with the attached heat spreader is placed in a first mold section. A substrate having a semiconductor die attached and electrically coupled to it are placed in a second mold section and then the first and second mold sections are mated such that the die is covered by the heat spreader. The granular mold compound is then melted so that the mold compound covers the die and sides of the heat spreader. The first and second mold sections then are separated. The film, which adheres to the substrate, is removed to expose a top surface of the heat spreader, and thus a semiconductor device is formed.
Author Ibrahim, Ruzaini
Teng, Seng Kiong
Author_xml – sequence: 1
  givenname: Ruzaini
  surname: Ibrahim
  fullname: Ibrahim, Ruzaini
– sequence: 2
  givenname: Seng Kiong
  surname: Teng
  fullname: Teng, Seng Kiong
BookMark eNrjYmDJy89L5WSw8U0tychPUchPU0gsLk7NTcrJzEtXADIyk_PzUkqTS_KLFFJSyzKTUxXKM0syFDJSE0sUiguKUhNTUot4GFjTEnOKU3mhNDeDgptriLOHbmlxQWJJal5JcXx6USKIMrAwMDQyt7Q0JkIJANXbMrU
ContentType Patent
CorporateAuthor Freescale Semiconductor, Inc
CorporateAuthor_xml – name: Freescale Semiconductor, Inc
DBID EFH
DatabaseName USPTO Issued Patents
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EFH
  name: USPTO Issued Patents
  url: http://www.uspto.gov/patft/index.html
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 08012799
GroupedDBID EFH
ID FETCH-uspatents_grants_080127993
IEDL.DBID EFH
IngestDate Sun Mar 05 22:34:33 EST 2023
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-uspatents_grants_080127993
OpenAccessLink https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8012799
ParticipantIDs uspatents_grants_08012799
PatentNumber 8012799
PublicationCentury 2000
PublicationDate 20110906
PublicationDateYYYYMMDD 2011-09-06
PublicationDate_xml – month: 09
  year: 2011
  text: 20110906
  day: 06
PublicationDecade 2010
PublicationYear 2011
References Tang et al. (6246115) 20010600
Espiritu (2007/0235859) 20071000
Ohtani (7820486) 20101000
Sakai et al. (6603154) 20030800
Bemmerl et al. (7064429) 20060600
Xu (2009/0221114) 20090900
Nakayama (6921683) 20050700
Lo et al. (6951776) 20051000
Lee et al. (6614123) 20030900
Guan et al. (6432742) 20020800
Akutagawa et al. (7638367) 20091200
R. Ibrahim, L.C. Tan, K.H. Tan, and Calvin Lo, Heat Spreader in Array Design to Minimize Processing Time, IP.COM IPCOM000007584D, Apr. 8, 2002.
Libres (6432749) 20020800
Xu et al. (2009/0236713) 20090900
References_xml – year: 20051000
  ident: 6951776
  contributor:
    fullname: Lo et al.
– year: 20101000
  ident: 7820486
  contributor:
    fullname: Ohtani
– year: 20020800
  ident: 6432749
  contributor:
    fullname: Libres
– year: 20030900
  ident: 6614123
  contributor:
    fullname: Lee et al.
– year: 20071000
  ident: 2007/0235859
  contributor:
    fullname: Espiritu
– year: 20091200
  ident: 7638367
  contributor:
    fullname: Akutagawa et al.
– year: 20020800
  ident: 6432742
  contributor:
    fullname: Guan et al.
– year: 20010600
  ident: 6246115
  contributor:
    fullname: Tang et al.
– year: 20090900
  ident: 2009/0221114
  contributor:
    fullname: Xu
– year: 20090900
  ident: 2009/0236713
  contributor:
    fullname: Xu et al.
– year: 20060600
  ident: 7064429
  contributor:
    fullname: Bemmerl et al.
– year: 20030800
  ident: 6603154
  contributor:
    fullname: Sakai et al.
– year: 20050700
  ident: 6921683
  contributor:
    fullname: Nakayama
Score 2.8261197
Snippet A method for packaging a semiconductor die or assembling a semiconductor device that includes a heat spreader begins with attaching the heat spreader to a film...
SourceID uspatents
SourceType Open Access Repository
Title Method of assembling semiconductor device with heat spreader
URI https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8012799
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1NSwMxEB3aIqgnRcX6RQ69pt3u94I36bIISg8WeitJk_Vik2WzpX_fmawUL3pNIAlJZt7M8PICMIkiRRcp5BLRgcdoEzxHXOPJFrFzLkIqOhDb4j2tVvHrOlkPoDq-hdmhGfEG1-Kme9d01pMr0b33B8978WfSCDSkPnAwX1aopapn5GmzohjCMA-I2rUoq3M4xSEwZDOd-wUa5QWcLH3rJQy0uYLnN_9ZM7M1w4BV7yQ9BGeOyOnWkOqqbZnSZLiMiqOMvCRzTeu5xtfAysXHS8WPU20-W6KwbIKfJUU3MMJUXt8CU6KghEzMt0kRy0zLLEq0DkSo0rpOczWG8Z_D3P3Tdw9nfa2TFAUeYNS1e_2IYNnJJ78T38d_dLo
link.rule.ids 230,309,786,808,891,64394
linkProvider USPTO
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV07T8MwED6VgnhMIECUpwdWQ5tnI3WDRuFVZQCpWxTXDgu1ozgVf587p6pYYLUl27J9992dPn8GuPV9SRfJ4wLRgQdoE3yMuMbDBWLnqPSo6EBsi1mUfQTP83Deg2zzFmaJZsRrXIu9W9m6NY5cie69O3jeiT-TRqAm9YFv_WVKmcvqnjxtnCRbsE0YSyr60zQ7gD0cBIM23dpfsJEewk7uWo-gp_QxTN7cd83MVAxDVrUU9BScWaKnG026q6ZhUpHpMiqPMvKTzNaNYxufAEun7w8Z30xVfDZEYimG60X5p9DHZF6dAZNlQilZOVqESSBiJWI_VGpYejKqqmgsBzD4c5jzf_puYDd_TIvXp9nLBex3hU-SF7iEftus1BUiZyuu3ab8AKivd7Q
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Method+of+assembling+semiconductor+device+with+heat+spreader&rft.inventor=Ibrahim%2C+Ruzaini&rft.inventor=Teng%2C+Seng+Kiong&rft.number=8012799&rft.date=2011-09-06&rft.externalDBID=n%2Fa&rft.externalDocID=08012799