Underfill dispensing system for integrated circuits

• Main Authors: Manikam, Vittal Raja, Lee, Yit Meng, Manikam, Vemal Raja
• Format: Patent
• Language: English
• Published: 02.08.2011

A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the...