Integrated circuit packages incorporating an inductor and methods
Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one side to the other side of the lead...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
28.06.2011
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Online Access | Get full text |
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Abstract | Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one side to the other side of the lead frame, thereby forming coil segments. After mounting the integrated circuit and wire bonding its connections, the lead frame is placed on a ferrite plate, the assembly is encapsulated in resin, and the leads trimmed and bent. Mounting of the packaged integrated circuit on a properly prepared printed circuit interconnects the coil segments in the package to coil segments on the printed circuit, thereby forming a single, multi-turn coil around the ferrite plate. Various embodiments are disclosed. |
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AbstractList | Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one side to the other side of the lead frame, thereby forming coil segments. After mounting the integrated circuit and wire bonding its connections, the lead frame is placed on a ferrite plate, the assembly is encapsulated in resin, and the leads trimmed and bent. Mounting of the packaged integrated circuit on a properly prepared printed circuit interconnects the coil segments in the package to coil segments on the printed circuit, thereby forming a single, multi-turn coil around the ferrite plate. Various embodiments are disclosed. |
Author | McQuirk, Ignacio Kalje, Nitin Ashrafzadeh, Ahmad Izadinia, Mansour |
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References | "International Search Report and Written Opinion of the International Searching Authority Dated Jan. 12 2010", International Application No. PCT/US2009/059581. Lotfi et al. (2007/0075817) 20070400 Balakrishnan (5161098) 19921100 Feng et al. (2009/0134503) 20090500 Schmidt (5949295) 19990900 (0531687) 19930300 Dadafshar et al. (2006/0145800) 20060700 |
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Snippet | Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a... |
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