Polymer for filling gaps in semiconductor substrate and coating composition using the same

A polymer for filling gaps in a semiconductor substrate and a composition using the polymer are provided. According to the composition, holes having a diameter of 100 nm or less and an aspect ratio (i.e. a ratio between the diameter and height of the holes) of 1 or higher in semiconductor substrates...

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Bibliographic Details
Main Authors Sung, Hyun Hoo, Kim, Jong Seob, Lee, Sun Yul, Oh, Seung Bae, Kim, Dae Yun
Format Patent
LanguageEnglish
Published 24.05.2011
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