Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures

A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the mul...

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Bibliographic Details
Main Authors Dubois, Geraud Jean-Michel, Hedrick, James Lupton, Kim, Ho-Cheol, Lee, Victor Yee-Way, Magbitang, Teddie Peregrino, Miller, Robert Dennis, Sankarapandian, Muthumanickam, Sundberg, Linda Karin, Volksen, Willi
Format Patent
LanguageEnglish
Published 26.04.2011
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