Flexible circuit electronic package with standoffs

A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This packag...

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Bibliographic Details
Main Authors Alcoe, David J, Calmidi, Varaprasad V
Format Patent
LanguageEnglish
Published 14.12.2010
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Summary:A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.